TSSART Resin Tape for Epoxy Resin Molding - Thermal Silicone Adhesive  Oxidation and High Temperature Resistance Easy Peeling, Epoxy Release Tape  for

TSSART Resin Tape for Epoxy Resin Molding - Thermal Silicone Adhesive Oxidation and High Temperature Resistance Easy Peeling, Epoxy Release Tape for

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HIGH TEMPERATURE RESISTANCE: TSSART resin tape can withstand up to 200℃ for half an hour making it is able to work in craft projects like

This extra wide 2.83” WiseBond Epoxy Release Tape quickly covers epoxy frames saving time and money. The tape is designed specifically for use as a non-stick barrier release agent to make removing cured epoxy easy. This strong, smooth, and non-stretch tape sticks to most materials when building river tables and epoxy project molds. Epoxy Release Tape is very strong, and non-stretch, making it incredibly useful for a wide range of epoxy resin applications.

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