New Highly Flexible Silver Conductive Epoxy Adhesive

Master Bond EP21TDCSFL is a new two component, room temperature curing, silver filled, epoxy adhesive developed by Master Bond Inc., Hackensack, N.J. It exhibits high flexibility and has an elongation of >60%. EP21TDCSFL is easy to use and has a 1 to 1 mix ratio by weight or volume. It cures at room temperatures or more rapidly at elevated temperatures.

Electrically conductive epoxy

Spec. Gravity 2.32 g/cc Mixed Viscosity 995000 cP at temp 25.0 °C Mechanical Properties Hardness, Shore D 80 Adhesive Bond Strength 90 psi Lap shear 2

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