Permabond ET5441 400 ml Cartridge Two-Part Epoxy - Chemical Concepts

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Permabond ET5441 is a thixotropic, thermally conductive two-component adhesive based on epoxy resin. It is specifically designed to bond metal substrates when excellent resistance to high temperature is required. The full cure is achieved in 7 days at room temperature, but it can be obtained in 24 hours at room temperature followed by 30 minutes at +80°C (176°F). Permabond ET5441 provides excellent resistance to motor oil, glycol and hot and cold water. Permabond ET5441 has been specifically formulated to meet the requirements of:Flammability rating UL94 HBThermal vacuum outgassing test for the screening of space material ECSS-Q-ST-70-02C Features & Benefits Full cure at room temperature Adhesion to a variety of substrates Thermally conductive High temperature resistance Excellent chemical resistance Physical Properties of Uncured Adhesives ET540 A sideET540 B Side Chemical composition Epoxy ResinAmine Hardener Appearance White Dark Grey Viscosity @ 23°C 25,000 mPa.s (cP) Thixo22,000 mPa.s (cP) Thixo Specific gravity 2:1 2.1 Typical Curing Properties Mix ratio 2:1 by weight 2.1 by volume Maximum gap fill2 mm 0.08 in Usable / pot life @23°C 150 minutes Handling time @23°C 150 minutes Working strength @23°C 8 hours Full cure @23°C23°C (77°F): 7 days 80°C (176°F): 2 hours