Description: Thermally conductive adhesive 10 g. The AG TermoGlue thermo-conductive adhesive is an excellent way to fix heat sinks, e.g. on
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High Thermal Conductivity - With a thermal conductivity rate of 0.975W/m-K, this thermal conductive glue helps disperse heat effectively from MOSFETs, LEDs, ICs, GPU chipsets, and other electronic components that require direct bonding. It is suitable for all heatsinks without a fixed clip, and can be used for a wide range of applications.
Bymugo 2 Pack 10g (20g in Total) HY910 0.975W/m-k Thermal Conductive Glue, High-Performance Thermal Plaster, Silicone Viscous Adhesive Cooling