Low-melt is applied at 265° F. to bond heat sensitive substrates such as polystyrene foam.Excellent hot-tack when dispensed at low-melt temperatures. Can bond expanded polystyrene, corrugated packaging and displays. 25 second bonding range. FDA listed.
3M+3762+LMQ+Hot+Melt+Adhesive for sale online
3M Hot Melt Adhesives
Low-melt is applied at 265° F. to bond heat sensitive substrates such as polystyrene foam.40 second bonding range when dispensed at low-melt temperature. Bonds wood, corrugated, polyolefins and other light-weight materials. FDA listed.
3M Hot Melt Adhesive 3762 AE, Tan, 0.45 in x 12 in
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